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Hot Swap

Enhanced Definition

In the context of IBM z/OS and mainframe hardware, a hot swap refers to the ability to replace or add a hardware component (e.g., a disk drive, power supply, or I/O adapter) while the system, `LPAR`, or `CEC` remains fully operational, without requiring a system shutdown or interruption to running workloads. Its primary purpose is to maintain continuous availability and minimize downtime for mission-critical applications.

Key Characteristics

- Zero Downtime: The most critical characteristic, allowing component replacement without interrupting system operations or application availability.
- Hardware-Centric: Primarily applies to physical hardware components designed with hot-pluggable interfaces and connectors.
- Redundancy Dependent: Often relies on underlying hardware redundancy (e.g., RAID configurations for DASD, redundant power supplies) to absorb the temporary loss of a component.
- Dynamic Configuration: Supported by the z/OS operating system and System z hardware architecture, which can dynamically recognize and integrate new or removed components.
- Error Isolation: Designed to isolate the component being swapped, preventing impact on other system resources or running applications.
- Specialized Hardware: Requires specific hardware design, such as hot-pluggable bays, connectors, and power management circuits.

Use Cases

- Replacing a Failed DASD: Swapping out a faulty disk drive in a RAID array or storage subsystem without impacting data access for z/OS volumes.
- Power Supply or Fan Unit Replacement: Replacing a failing power supply unit or cooling fan in a System z Central Electronic Complex (CEC) or `